What You Need to Know About Probe Card Repair

Comments · 47 Views

If you have been considering repairing your probe card, there are several things you need to know about the process. One thing to keep in mind is that the design of the probe card plays a significant role in how the test will go.

If you have been considering repairing your probe card, there are several things you need to know about the process. One thing to keep in mind is that the design of the probe card plays a significant role in how the test will go. For example, pad size and pitch play a large role in the overall design of the probe card. Another factor that can affect the test is the wear and tear on the tips of the probe. The use of an overdrive can also cause this to happen.

Basic guidelines for probe card repair

There are many things to consider when it comes to probe card repair. It is not just about making sure that your product is functional, but it is also about maintaining its integrity. This can be done by performing regular inspections with a probe card analyzer.

It is important to note that the most basic function of a probe card is to make contact with the metal pads on the surface of a wafer. These metal pads are typically covered with a thin glass-like material known as oxide.

The Probe Card Repair is an important part of IC testing. Testers send a series of electrical signals to each IC. An IC's response to these test signals indicates that the IC was made properly.

Overdrive causes wear on probe tips

A test probe can be made of many different materials, including platinum, gold, aluminum and beryllium copper. Each of these material types can provide a unique set of benefits. For example, gold-plated probes are capable of minimizing contact resistance while maximizing material hardness. The latter may be crucial in applications where abrasives are encountered.

In addition, the most appropriate design can help minimize the impact of stress on the probe. This is particularly important for probes that are used in aluminized wafer testing. Specifically, it can reduce the risk of tip scarring. However, too much overdrive can negatively affect the quality of your products.

Pad size and pitch affect probe card design

Probing pads are used in a variety of applications. These include low current testing, high-speed tests, and cold temperature testing. Each of these requires a probe card. The probe card design includes pad size, pitch, and current capability.

Pad sizes vary depending on the number of probes. Ideally, each pad in a row should be identical in height and pitch. However, non-planarity can occur due to the different metal stacks on a pad in a row. This can increase the contact force, and can be a factor in the failure of the probe.

Pitch is the difference in height between the bottom and top of the pad. Ideally, the overall planar deviation of a row of pads contacted by one probe should be 2000 ppm.

Probe to probe planarization affects test variables

When testing semiconductors, probe to probe planarization can have a huge impact on the results. Fortunately, there are some proven methods for making sure your ICs are working properly, from the very first pass. The key is to keep an eye on two things - the planarity of the substrate and the resistance between the bonding pads. This will prevent you from generating false results due to low resistance paths snaking between the pad layers and the interposer.

One of the simplest ways to accomplish this is to use the standard procedure. Each conductive probe is individually patterned on the test substrate. A second masking layer is applied to the lower level portions.


The PB6500 Probe Card Repair System is a specialized tool that enables efficient repair and inspection of probe cards. This system offers the latest probe tip geometries for superior electrical contact and positioning accuracy. It is perfect for all probe card technologies.

A probe card is a device that is used in electrical testing of LSI chip electrodes. It is inserted into a wafer prober to conduct testing. There are several factors that affect the efficiency of a probe card. One of them is the number of DUTs that are tested in parallel. For example, if 16 devices are tested in parallel, the time required to test one device is reduced by 11 minutes.

Compass test station

The Compass test station has many features and functions that will make your life easier. A few of these features include a high precision wafer chuck and a gripper arm to hold a wide range of probe cards in place. These features are great for when you need to perform maintenance on epoxy probe cards or for when you need to planarize a probe.

One of the most impressive features of the Compass test station is its gripper arm which holds the full construction of a blade probe card. While the chuck is in position, the operator can readjust the tip to an appropriate slant using the stage 660.